Wafer Probe and Sort
Every die is tested while still on the wafer, so failures are mapped and discarded before any packaging cost is spent on them.
Proving the part works, and keeps working.
Test is where a packaging line discovers what it actually produced. For automotive parts the reliability burden extends far past functional test into qualification programmes measured in months.
Every die is tested while still on the wafer, so failures are mapped and discarded before any packaging cost is spent on them.
The packaged part is exercised across its full electrical specification on automated test equipment, the operation that decides what actually ships.
The mechanical interface between a packaged part and the test head, plus the consumable parts an automated test line wears through.
The robotics that present each part to the test head at temperature and sort it into bins afterwards. Throughput of the test cell is set here, not by the tester.
Parts are held at elevated voltage and temperature for hours or weeks to force out infant mortality, and stressed to characterise how the population ages.
The lab that establishes why a part failed: acoustic imaging for delamination, X-ray for voids, cross-sectioning and electron microscopy for everything else.
The formal programmes (AEC-Q for automotive, JEDEC for the rest) that a package and its supply chain must pass before a customer will accept the part.