Die-Attach Adhesive and Film

The epoxy paste or adhesive film that bonds the die to its leadframe or substrate, and carries heat away from it.

Tier A: Buildable Now Low criticality

Blending and quality control rather than capital equipment, which puts it within reach of an existing Indian chemical MSME.

What It Does

The glue that sticks the chip down and pulls heat away

Bonds the die to its frame and helps carry heat off it.
A hidden defect here can pass testing and fail later in the field.
One of the most accessible entries here: chemistry, not heavy capital.

India Position

Import dependency: Not established
Made in India today: None
MSME entry capital: Rs 1.5–3 Cr
Time to qualify: 12–18 months

Not established means we hold no sourced import figure for this input yet, not that India imports none of it. Read Made in India today for the domestic picture.

India has a broad specialty-chemicals base, but no publicly confirmed semiconductor-qualified die-attach production.

What Breaks, and Who Could Fix It

What breaks

Automotive programmes increasingly specify film die-attach over paste, for bond-line uniformity and thermal-cycling reliability.

Who could fix it

12-18 months from formulation to a qualified, revenue-generating relationship, by analogy with the leadframe timeline.

Best and worst case

Best case if this breaks

Standard epoxy paste is lower-volume and less exotic chemistry than moulding compound or bonding wire, with multiple qualified formulations typically available.

Worst case if this breaks

Voiding or delamination under the die is a hidden defect; it passes test and fails in the field. The same downstream automotive-audit exposure as an underfill failure.

Best case to fix it

Rs 1.5-3 crore, in the specialty-chemicals bracket. Chemical blending and QC rather than heavy capital equipment, one of the most accessible entries here.

Worst case to fix it

Automotive-grade film die-attach needs film-casting and coating technology, closer to the moulding-compound bracket than to plain chemicals. A harder first product than paste.

Representative Suppliers

Listing a firm documents the market as we understand it. It is not an endorsement, a recommendation, or evidence of any commercial relationship.

Supplier	Origin	Scale	Confidence
Henkel Named in the TSAT report among established formulators.	Germany	Mega	Reported
Resonac	Japan	Large	Likely
Nitto Denko	Japan	Large	Likely
Lintec	Japan	Mid	Likely

Where It Is Consumed

Step 2: Die Attach

The die is bonded to a leadframe or substrate using epoxy paste, adhesive film, or solder.

Sources

TSAT packaging process and MSME component map as of 2026-08

Last reviewed 2026-08-28.

How to read this page

Reading Key

Every entry carries the same five figures, so two inputs anywhere in the chain can be compared directly. What each one is, and what it is not:

Import dependency: The share of Indian demand for this input that is met by imports today. A percentage is published only where we can state the basis for it, and the build rejects a figure that has none. “Not established” means no sourced figure exists yet, not that the figure is zero; for the domestic picture, read “Made in India today” instead.
Made in India today: How much of this input is actually produced in India: none, pilot scale, partial, or established. This is the field to read when import dependency is not established.
MSME entry capital: What it would plausibly cost an Indian MSME to enter this input at the smallest viable scale, in crore rupees. Plant and equipment only; it excludes working capital and the qualification cycle.
Time to qualify: How long from a working sample to a qualified first shipment, once the line exists. Qualification, not construction, is what usually decides whether an entry succeeds.
India readiness tier: Our verdict on whether an Indian founder can realistically enter this input, derived from the four figures above and stated as one of three tiers.

The three tiers

Tier A: Buildable Now: Under roughly Rs 5 crore of entry capital and 12 to 24 months to a qualified first shipment. A founder can start here.
Tier B: Partnership or Distribution: There is real money here, but not in manufacturing the thing. The opening is in stocking, distribution, purity uplift or a licensed partnership.
Tier C: Not Yet: Requires a joint venture, a technology licence, or a multinational’s balance sheet. Worth understanding, not worth starting.

Made in India today

None: No Indian production we can identify. Demand is met entirely from abroad.
Pilot scale: Made in India at laboratory, pilot-line or single-customer scale only.
Partial: Real Indian production exists, but it covers part of the range or part of the demand.
Established: Indian production is routine and qualified, at commercial volume.

Confidence

Confidence describes how well evidenced our listing is. It is not a rating of the supplier or of its products.

Verified: Checked against a primary source: the firm’s own filing, product documentation or announcement.
Reported: Consistently reported by trade press or industry analysts, but we have not seen the primary document ourselves.
Likely: A credible supplier for this input given their product range, though we have not confirmed that they actually supply it.
Directional: Included to show the shape of the market. Read it as an observation, not as a claim about this firm.

Scale

Scale is a bucket, not a revenue figure. We publish a band we can hold for years rather than a number that is stale in a quarter.

Mega: A global top-tier firm that effectively sets the price and the standard for this input.
Large: A major international supplier, usually with plants or sales in several regions.
Mid: An established specialist, often strong in one region or one product family.
Small: A niche or regional supplier. Frequently the realistic first partner for a new Indian entrant.