Every other page in this directory describes something a plant buys. This one lists the plants: the sanctioned fabs and packaging lines that are the customer for all of it.
Announced or sanctioned capital, in rupees crore. These are commitments rather than money spent, and they are the figures most likely to be revised, each is dated on its card below.
| Site | Investment |
|---|---|
| Tata Electronics | Rs 91,526 Cr |
| Tata Semiconductor Assembly and Test | Rs 27,120 Cr |
| Micron Technology | Rs 22,516 Cr |
| CG Semi | Rs 7,584 Cr |
| HCL-Foxconn OSAT | Rs 3,706 Cr |
| Kaynes Semicon | Rs 3,307 Cr |
| SiCSem | Rs 2,066 Cr |
| 3D Glass Solutions | Rs 1,943 Cr |
| ASIP Technologies | Rs 468 Cr |
Where silicon is patterned. The most capital-intensive segment, and the one with the longest gap between sanction and first revenue.
Dholera Special Investment Region, Gujarat
With Powerchip Semiconductor Manufacturing Corporation (Taiwan)
India’s first 300mm wafer fab, targeting up to 50,000 wafer starts a month on 28nm to 110nm nodes for power management ICs, microcontrollers and display drivers.
Bhubaneswar, Odisha
India’s first commercial silicon carbide compound semiconductor fab, for high-voltage power devices used in EV drivetrains and grid electronics.
Bhubaneswar, Odisha
Glass-core substrate and 3D heterogeneous integration packaging for RF, photonics and AI applications, where glass outperforms organic laminate on high-frequency loss and thermal behaviour.
The segment India is actually building fastest, and the one every packaging-materials entry in this directory ultimately sells into.
Jagiroad, Morigaon district, Assam
With Tata Electronics
Wire bond, flip chip and integrated systems packaging, with a stated design capacity in the order of 48 million chips a day. India’s largest single ATMP investment.
Sanand, Gujarat
Assembly, test and packaging of DRAM and NAND memory for export. The first large ATMP plant to reach operation in India and the anchor for Sanand’s supplier cluster.
Sanand, Gujarat
With CG Power and Industrial Solutions · Renesas Electronics (Japan) · Stars Microelectronics (Thailand)
Full-service OSAT covering traditional and advanced packaging for automotive, industrial and IoT microcontrollers and analog parts.
Sanand, Gujarat
Wire bond, substrate-based and multi-chip module packaging, plus co-packaged optics. Delivered India’s first commercially packaged multi-chip modules.
Jewar (near Noida International Airport), Uttar Pradesh
With HCL Group · Foxconn (Taiwan)
OSAT for display driver chips and PMICs targeting the domestic smartphone, automotive and IT hardware supply chains.
Andhra Pradesh, Andhra Pradesh
Assembly and test targeted at power semiconductors and specialty analog parts.
Mohali, Punjab
Discrete-semiconductor assembly expansion at the existing CDIL Mohali plant; augments long-standing rectifier, transistor and MOSFET packaging capacity.
Bhiwadi, Rajasthan
Memory packaging (microSD, USB flash) at one of the first operating non-ISM OSATs in India. First commercial packaged chip shipped from India.
Surat, Gujarat
Legacy-node packaging for discrete and small-signal analog parts. A privately funded OSAT operating outside the ISM sanction umbrella.
Panvel, Maharashtra
Announced OSAT for automotive and consumer electronics packaging; not yet in production.
Confidence describes how well evidenced our listing is. It is not a rating of the supplier or of its products.
How to read this. Investment figures are sanctioned or announced amounts, not amounts spent, and every card carries the month the figure was last checked. Listing a site documents the public record; it is not a claim of any commercial relationship. If you supply into one of these plants and something here is wrong, we would rather hear it than leave it standing.